国際会議
テキスト形式論文リスト(ギリシャ文字は手で修正してください.)
Author |
Title |
Publisher |
Page |
Year/Month |
Venue |
PDF |
T. Kishita, R. Kishida, and K. Kobayashi |
Investigation of the Time-Dependent BTI-induced Degradation Distribution for Ring Oscillators in Ultra-Long-Term Stress Conditions |
IEEE International Reliability Physics Symposium (IRPS) |
pp. P1.CR.1-P1.CR.4 |
2025/04 |
Monterey, CA, USA |
pdf |
T. Imagawa, R. Kishida, Y. Koyama, K. Kobayashi, and T. Miyoshi |
A Power Reduction Scheme by Arithmetic Format Conversion for a DSP to Estimate Qubit States Under 4K Cryogenic Environment |
IEEE International Conference on Quantum Computing and Engineering (QCE) |
pp. 539-540 |
2024/09 |
Montreal Canada |
pdf |
R. Toda, R. Kishida, K. Kobayashi, T. Matsuura, R. Miyauchi, A. Hyogo |
An Evaluation Circuit for Hot Carrier Injection (HCI) Using Stage Switching Function |
International Workshop on Post-Binary ULSI Systems (ULSIWS) |
p. 7 |
2024/05 |
Brno, Czech |
pdf |
R. Nagasue, I. Mizuno, R. Kishida, T. Iwata, and T. Yoshikawa |
A Fractional-N PLL for Multi-phase Clock Generation with Loop Bandwidth Enhancement |
IEEE International Symposium on Circuits and Systems (ISCAS) |
ID2146.1-5 |
2024/05 |
Sentosa Island, Singapore |
pdf |
D. Kikuta, R. Kishida, and K. Kobayashi |
Ring Oscillators with identical Circuit Structure to Measure Bias Temperature Instability |
IEEE International Conference on ASIC (ASICON) |
D8-5 |
2023/10 |
Nanjing, China |
none |
W. Bae, R. Kishida, T. Matsuura, and A. Hyogo |
Reducing One Operational Amplifer in an 8-bit Third-Order Noise-Shaping Successive Approximation Register Analog-to-Digital Converter with Error-Feedback Structure |
International Conference on Analog VLSI Circuits (AVIC) |
pp. 1-5 |
2022/10 |
Hybrid (Hiroshima-shi, Hiroshima, Japan/Online) |
pdf |
K. Takayanagi, R. Kishida, T. Matsuura, and A. Hyogo |
Undershoot Reduction at Load Change by a Capacitor Connecting Circuit in Hysteretic DC-DC Buck Converter |
International Conference on Analog VLSI Circuits (AVIC) |
pp. 215-219 |
2021/10 |
Hybrid (Bordeaux, France/Online) |
pdf |
Y. Susa, R. Kishida, T. Matsuura, and A. Hyogo |
Transition Response Improvement of Current Sensing Circuit Using Hysteresis Comparator in Buck-Boost Converter for Mobile Devices |
International Conference on Analog VLSI Circuits (AVIC) |
pp. 210-214 |
2021/10 |
Hybrid (Bordeaux, France/Online) |
pdf |
K. Nakamura, T. Matsuura, R. Kishida, and A. Hyogo |
Two Stage Boost Converter with One Inductor for Energy Harvesting |
International Conference on Analog VLSI Circuits (AVIC) |
pp. 200-203 |
2021/10 |
Hybrid (Bordeaux, France/Online) |
pdf |
R. Hirai, R. Kishida, T. Matsuura, and A. Hyogo |
An 8-bit Hybrid Analog-to-Digital Converter Combining Flash with Radix-3 and Two-bit/cycle Successive Approximation Register Analog-to-Digital Converter |
International Conference on Analog VLSI Circuits (AVIC) |
pp. 65-70 |
2021/10 |
Hybrid (Bordeaux, France/Online) |
pdf |
Y. Susa, R. Kishida, T. Matsuura, and A. Hyogo |
Mode Transition Improvement by Adding Load Current Sensing Circuit in a Buck-Boost Converter for Mobile Devices |
Workshop on Synthesis And System Integration of Mixed Information Technologies (SASIMI) |
pp. 132-136 |
2021/03 |
Online |
pdf |
K. Saito, R. Kishida, T. Matsuura, and A. Hyogo |
A K-band High Gain Linearity Mixer with Current-Bleeding and Derivative Superposition Technique |
Workshop on Synthesis And System Integration of Mixed Information Technologies (SASIMI) |
pp. 51-55 |
2021/03 |
Online |
pdf |
R. Kishida, I. Suda, and K. Kobayashi |
Bias Temperature Instability Depending on Body Bias through Buried Oxide (BOX) Layer in a 65 nm Fully-Depleted Silicon-On-Insulator Process |
IEEE International Reliability Physics Symposium (IRPS) |
pp. 4A.6.1-4A.6.6 |
2021/03 |
Online |
pdf |
Y. Tanaka, T. Matsuura, R. Kishida, and A. Hyogo |
Duty Ratio and Capacitance Analysis of AC/DC Converter without Current Control Circuit |
International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS) |
pp. O19.6.1-O19.6.2 |
2019/12 |
Taipei, Taiwan |
pdf |
Y. Unno, T. Matsuura, R. Kishida, and A. Hyogo |
Examination of Incremental ADC with SAR ADC To Reduce Conversion Time with High Accuracy |
International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS) |
pp. O17.4.1-O17.4.2 |
2019/12 |
Taipei, Taiwan |
pdf |
Y. Kobayashi, T. Matsuura, R. Kishida, and A. Hyogo |
Investigation of Hybrid ADC Combined with First-Order Feedforward Incremental and SAR ADCs |
International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS) |
pp. O17.3.1-O17.3.2 |
2019/12 |
Taipei, Taiwan |
pdf |
T. Asuke, R. Kishida, J. Furuta, and K. Kobayashi |
Temperature Dependence of Bias Temperature Instability (BTI) in Long-term Measurement by BTI-sensitive and -insensitive Ring Oscillators Removing Environmental Fluctuation |
IEEE International Conference on ASIC (ASICON) |
pp. B8.5.1-B8.5.4 |
2019/11 |
Chongqing, China |
none |
K. Satou, T. Matsuura, R. Kishida, and A. Hyogo |
Cross Switch to Output Input Voltage Alternately |
International Conference on Analog VLSI Circuits (AVIC) |
pp. AT2.1.1-AT2.1.3 |
2019/10 |
Yilan, Taiwan |
pdf |
Y. Tanaka, T. Matsuura, R. Kishida, and A. Hyogo |
A Worldwide Input Voltage AC/DC Converter Using a Capacitor Instead of Current Control |
International Conference on Analog VLSI Circuits (AVIC) |
pp. PM.3.1-PM.3.6 |
2019/10 |
Yilan, Taiwan |
pdf |
S. Sekine, T. Matsuura, R. Kishida, and A. Hyogo |
Design Theory of Sub-Radix-3 SAR-ADC with C-C Ladder Based D/A Converter |
International Conference on Analog VLSI Circuits (AVIC) |
pp. CONV.5.1-CONV.5.6 |
2019/10 |
Yilan, Taiwan |
pdf |
T. Hosaka, S. Nishizawa, R. Kishida, T. Matsumoto, and K. Kobayashi |
Compact Modeling of NBTI Replicationg AC Stress / Recovery from a Single-shot Long-term DC Measurement |
IEEE International Symposium on On-Line Testing and Robust System Design (IOLTS) |
pp. 305-309 |
2019/07 |
Rhodes Island, Greece |
pdf |
R. Kishida, T. Asuke, J. Furuta, and K. Kobayashi |
Extracting BTI-induced Degradation without Temporal Factors by Using BTI-Sensitive and BTI-Insensitive Ring Oscillators |
IEEE International Conference on Microelectronic Test Structures (ICMTS) |
pp. 24-27 |
2019/03 |
Kitakyushu, Japan |
pdf |
S. Sekine, T. Matsuura, R. Kishida, and A. Hyogo |
A Novel C-2αC Ladder Based Non-binary DAC for SAR-ADC Using Unit Capacitors |
International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS) |
pp. 457-462 |
2018/11 |
Ishigaki, Okinawa, Japan |
pdf |
R. Kudo, T. Matsuura, R. Kishida, and A. Hyogo |
Consideration on Noise-Shaping SAR ADC in Incremental Use for High Resolution and Low Power Application |
International Conference on Analog VLSI Circuits (AVIC) |
pp. 109-112 |
2018/11 |
Chiang Mai, Thailand |
pdf |
T. Mishiro, T. Matsuura, R. Kishida, and A. Hyogo |
A Digital Foreground Calibration Method Using Redundancy for SAR-ADCs |
International Conference on Analog VLSI Circuits (AVIC) |
pp. 105-108 |
2018/11 |
Chiang Mai, Thailand |
pdf |
R. Kishida, J. Furuta, and K. Kobayashi |
Plasma Induced Damage Depending on Antenna Layers in Ring Oscillators |
International Conference on Solid State Devices and Materials (SSDM) |
pp. 209-210 |
2017/09 |
Sendai, Japan |
pdf |
T. Komawaki, M. Yabuuchi, R. Kishida, J. Furuta, T. Matsumoto, and K. Kobayashi |
Circuit-level Simulation Methodology for Random Telegraph Noise by Using Verilog-AMS |
IEEE International Conference on IC Design and Technology (ICICDT) |
pp. I2.01-I2.04 |
2017/05 |
Austin, TX, USA |
none |
M. Yabuuchi, A. Oshima, T. Komawaki, R. Kishida, J. Furuta, K. Kobayashi, P. Weckx, B. Kaczer, T. Matsumoto, and H. Onodera |
Circuit Analysis and Defect Characteristics Estimation Methods Using Bimodal Defect-Centric Random Telegraph Noise Model |
ACM International Workshop on Timing Issues in the Specification and Synthesis of Digital Systems (TAU) |
pp. 47-52 |
2017/03 |
Monterey, CA, USA |
none |
R. Kishida, and K. Kobayashi |
Degradation Caused by Negative Bias Temperature Instability Depending on Body Bias on NMOS or PMOS in 65 nm Bulk and Thin-BOX FDSOI Processes |
IEEE Electron Devices Technology and Manufacturing (EDTM) |
pp. 122-123 |
2017/03 |
Toyama, Japan |
pdf |
R. Kishida, and K. Kobayashi |
Correlations between Plasma Induced Damage and Negative Bias Temperature Instability in 65 nm Bulk and Thin-BOX FDSOI Processes |
IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) |
pp. 25-27 |
2016/10 |
Burlingame, CA, USA |
pdf |
R. Kishida, and K. Kobayashi |
Negative Bias Temperature Instability by Body Bias on Ring Oscillators in Thin BOX Fully-Depleted Silicon on Insulator Process |
International Conference on Solid State Devices and Materials (SSDM) |
pp. 711-712 |
2016/09 |
Tsukuba, Japan |
none |
A. Oshima, T. Komawaki, K. Kobayashi, R. Kishida, P. Weckx, B. Kaczer, T. Matsumoto, and H. Onodera |
Physical-Based RTN Modeling of Ring Oscillators in 40-nm SiON and 28-nm HKMG by Bimodal Defect-Centric Behaviors |
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) |
pp. 327-330 |
2016/09 |
Nurnberg, Germany |
pdf |
R. Kishida, A. Oshima, and K. Kobayashi |
Negative Bias Temperature Instability Caused by Plasma Induced Damage in 65 nm Bulk and Silicon On Thin BOX (SOTB) Processes |
IEEE International Reliability Physics Symposium (IRPS) |
pp. CA.2.1-CA.2.5 |
2015/04 |
Monterey, CA, USA |
pdf |
R. Kishida, A. Oshima, M. Yabuuchi, and K. Kobayashi |
Initial Frequency Degradation and Variation on Ring Oscillators from Plasma Induced Damage in Fully-Depleted Silicon on Insulator Process |
IEEE/ACM Workshop on Variability Modeling and Characterization (VMC) |
none |
2014/11 |
San Jose, CA, USA |
none |
R. Kishida, A. Oshima, M. Yabuuchi, and K. Kobayashi |
Initial and Long-Term Frequency Degradation on Ring Oscillators from Plasma Induced Damage in 65 nm Bulk and Silicon On Thin BOX processes |
International Conference on Solid State Devices and Materials (SSDM) |
pp. 52-53 |
2014/09 |
Tsukuba, Japan |
none |
M. Yabuuchi, R. Kishida, and K. Kobayashi |
Correlation between BTI-Induced Degradations and Process Variations by Measuring Frequency of RO |
IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) |
pp. 128-131 |
2014/06 |
Kyoto, Japan |
pdf |